| CPU Speed (Tốc độ CPU) | 3.20GHz |
| Max Thermal Design Power (Công suất tiêu thụ tối đa) (W) | 53 |
| Bus Speed / HyperTransport | 5.0 GT/s ( 5000 MT/s - 2.5 Gb/s) |
| Manufacturing Technology ( Công nghệ sản xuất ) | 22 nm |
| Socket type | Intel - Socket LGA 1150 |
| Graphics Frequency (MHz) | 350 |
| Series | Intel - Pentium Dual-Core |
| Codename (Tên mã) | Intel - Haswell |
| Processor Number | G3258 |
| # of Cores | 2 |
| # of Threads | 2 |
| Clock Speed | 3.2 GHz |
| Cache | 3 MB |
| DMI2 | 5 GT/s |
| # of QPI Links | 0 |
| Instruction Set | 64-bit |
| Instruction Set Extensions | SSE4.1/4.2 |
| Embedded Options Available | No |
| Lithography | 22 nm |
| Scalability | 1S Only |
| Max TDP | 53 W |
| Thermal Solution Specification | PCG 2013C |
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Memory Specifications |
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| Max Memory Size (dependent on memory type) | 32 GB | |
| Memory Types | DDR3-1333 | |
| # of Memory Channels | 2 | |
| Max Memory Bandwidth | 21.3 GB/s | |
| ECC Memory Supported ‡ | Yes | |
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Graphics Specifications |
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| Processor Graphics ‡ | Intel® HD Graphics | |
| Graphics Base Frequency | 350 MHz | |
| Graphics Max Dynamic Frequency | 1.1 GHz | |
| Graphics Video Max Memory | 1.7 GB | |
| Intel® Quick Sync Video | Yes | |
| Intel® Clear Video HD Technology | No | |
| # of Displays Supported ‡ | 3 | |
|
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Expansion Options |
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| PCI Express Revision | 3.0 | |
| PCI Express Configurations ‡ | Up to 1x16, 2x8, 1x8/2x4 | |
| Max # of PCI Express Lanes | 16 | |
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Package Specifications |
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| Max CPU Configuration | 1 | |
| TCASE | 72°C | |
| Package Size | 37.5mm x 37.5mm | |
| Graphics and IMC Lithography | 22nm | |
| Sockets Supported | FCLGA1150 | |
| Low Halogen Options Available | See MDDS | |
|
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Advanced Technologies |
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| Intel® Turbo Boost Technology ‡ | No | |
| Intel® vPro Technology ‡ | No | |
| Intel® Hyper-Threading Technology ‡ | No | |
| Intel® Virtualization Technology (VT-x) ‡ | Yes | |
| Intel® Virtualization Technology for Directed I/O (VT-d) ‡ | No | |
| Intel® VT-x with Extended Page Tables (EPT) ‡ | Yes | |
| Intel® TSX-NI | No | |
| Intel® 64 ‡ | Yes | |
| Idle States | Yes | |
| Enhanced Intel SpeedStep® Technology | Yes | |
| Thermal Monitoring Technologies | Yes | |
| Intel® Stable Image Platform Program (SIPP) | No | |
|
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Intel® Platform Protection Technology |
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| Trusted Execution Technology ‡ | No | |
| Execute Disable Bit ‡ | Yes | |
| Processor Number | G3258 |
| # of Cores | 2 |
| # of Threads | 2 |
| Clock Speed | 3.2 GHz |
| Cache | 3 MB |
| DMI2 | 5 GT/s |
| # of QPI Links | 0 |
| Instruction Set | 64-bit |
| Instruction Set Extensions | SSE4.1/4.2 |
| Embedded Options Available | No |
| Lithography | 22 nm |
| Scalability | 1S Only |
| Max TDP | 53 W |
| Thermal Solution Specification | PCG 2013C |
|
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Memory Specifications |
||
| Max Memory Size (dependent on memory type) | 32 GB | |
| Memory Types | DDR3-1333 | |
| # of Memory Channels | 2 | |
| Max Memory Bandwidth | 21.3 GB/s | |
| ECC Memory Supported ‡ | Yes | |
|
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Graphics Specifications |
||
| Processor Graphics ‡ | Intel® HD Graphics | |
| Graphics Base Frequency | 350 MHz | |
| Graphics Max Dynamic Frequency | 1.1 GHz | |
| Graphics Video Max Memory | 1.7 GB | |
| Intel® Quick Sync Video | Yes | |
| Intel® Clear Video HD Technology | No | |
| # of Displays Supported ‡ | 3 | |
|
-
Expansion Options |
||
| PCI Express Revision | 3.0 | |
| PCI Express Configurations ‡ | Up to 1x16, 2x8, 1x8/2x4 | |
| Max # of PCI Express Lanes | 16 | |
|
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Package Specifications |
||
| Max CPU Configuration | 1 | |
| TCASE | 72°C | |
| Package Size | 37.5mm x 37.5mm | |
| Graphics and IMC Lithography | 22nm | |
| Sockets Supported | FCLGA1150 | |
| Low Halogen Options Available | See MDDS | |
|
-
Advanced Technologies |
||
| Intel® Turbo Boost Technology ‡ | No | |
| Intel® vPro Technology ‡ | No | |
| Intel® Hyper-Threading Technology ‡ | No | |
| Intel® Virtualization Technology (VT-x) ‡ | Yes | |
| Intel® Virtualization Technology for Directed I/O (VT-d) ‡ | No | |
| Intel® VT-x with Extended Page Tables (EPT) ‡ | Yes | |
| Intel® TSX-NI | No | |
| Intel® 64 ‡ | Yes | |
| Idle States | Yes | |
| Enhanced Intel SpeedStep® Technology | Yes | |
| Thermal Monitoring Technologies | Yes | |
| Intel® Stable Image Platform Program (SIPP) | No | |
|
-
Intel® Platform Protection Technology |
||
| Trusted Execution Technology ‡ | No | |
| Execute Disable Bit ‡ | Yes | |